Equipment

MRC’s 12,000 sq. ft. cleanroom supports advanced micro- and nanofabrication across silicon, III–V, and soft materials. Core capabilities include sub-20 nm electron-beam lithography, alongside deposition, etching, thermal processing, and comprehensive characterization tools.

MRC equipment is located in the North Cleanroom of the Microelectronics and Engineering Research Center (MER) on the J.J. Pickle Research Campus.

Please visit the Access page to learn how to become a user and gain access to MRC facilities, including project proposal and onboarding, required training, and equipment reservations.

 

Westbond Ball Bonder

Westbond Ball Wire Bonder 7400A

Location: MER 1.822
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westbond-wedge-bonder-

Westbond Wedge Wire Bonder

Location: MER 1.821
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K&S Au Ball Bonder

Wire Bonder (Au ball ) Kulicke & Soffa

Location: MER 1.820
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