Equipment

MRC’s 12,000 sq. ft. cleanroom supports advanced micro- and nanofabrication across silicon, III–V, and soft materials. Core capabilities include sub-20 nm electron-beam lithography, alongside deposition, etching, thermal processing, and comprehensive characterization tools.

MRC equipment is located in the North Cleanroom of the Microelectronics and Engineering Research Center (MER) on the J.J. Pickle Research Campus.

Please visit the Access page to learn how to become a user and gain access to MRC facilities, including project proposal and onboarding, required training, and equipment reservations.

 

Corial210 Chlorine ICP etcher III-V

Corial210 Chlorine ICP etcher

Location: MER 1.736
Etch
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Corial210 Fluorine ICP etcher for Si

Corial210 Fluorine ICP etcher

Location: MER 1.738
Etch
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Corial360 thick sample No Load Lock

Corial360 ICP Etcher Fluorine

Location: MER 1.75
Etch
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CPD Tousimis Critical Point Dryer

CPD Tousimis Critical Point Dryer

Location: MER 1.749
Etch
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PlasmaTherm 770 RIE

Etcher RIE 790 Plasma Therm #2

Location: MER 1.738
Etch
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Etcher ICP Oxford 100

Oxford 100 ICP Etcher

Location: MER 1.75
Etch
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Oxford DSE - Deep Si Reactive Ion etcher

Oxford DSE - Deep Si Reactive Ion Etcher

Location: MER 1.75
Etch
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Etcher RIE 790 Plasma Therm #1

Plasma Therm #1 Etcher RIE 790

Location: MER 1.75
Etch
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Quazar Ion Beam Deposition and Etching Milling

Location: MER 1.756
Etch
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Takachi Chlorine ICP ALE etcher

Takachi Chlorine ICP ALE etcher

Location: MER 1.75
Etch
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Etcher ICP Deep Silicon PlasmaTherm Versaline

Versaline ICP Deep Silicon Etcher

Location: MER 1.738
Etch
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